AMD unveils Ryzen 9 7945HX3D, the first notebook chip featuring 3D V-Cache technology

AMD introduces the world’s first notebook CPU, the Ryzen 9 7945HX3D, featuring their innovative 3D V-Cache technology.

AMD is a major competitor to Intel in the CPU (Central Processing Unit) market for personal computers and servers.

Over the years, AMD has developed various CPU architectures, including the Ryzen series for desktops, laptops, and servers.

The Ryzen processors have gained significant popularity for their strong performance, competitive pricing, and support for multi-core processing.

In addition to CPUs, AMD is a prominent player in the graphics processing unit (GPU) market. The company’s Radeon series of GPUs are widely used in gaming, professional workstations, and data centers.

One of AMD’s notable achievements is its role in developing the x86-64 instruction set architecture, which allows 64-bit processing in modern CPUs.

AMD’s contributions have led to significant advancements in computer performance and capabilities.

AMD also collaborates with various technology companies and manufacturers to integrate its processors and graphics solutions into a wide range of devices, including laptops, desktops, gaming consoles, and cloud-based servers.

The 7945HX3D is an enhanced version of the 7945HX, boasting twice the L3 cache.

While the L1 and L2 cache maintain their sizes at 1MB and 16MB, the L3 cache increases from the 7945HX’s 64MB to an impressive 128MB, resulting in a total cache of 145MB.

AMD first introduced the 3D V-Cache technology on the Ryzen 7 5800X3D desktop processor last year. This innovative technology adds an extra layer of memory directly onto the CPU die.

While most applications show no significant improvement with the added cache, games experience substantial benefits.

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The additional on-die memory reduces the need for frequent access to slower and physically distant system memory, resulting in faster frame processing and higher overall frame rates in games.

Apart from the additional L3 cache, the 7945HX3D closely resembles the 7945HX. It features 16 Zen4 cores and 32 threads, distributed evenly across two core complexes (CCD).

The cache is also split between the two CCDs, with one CCD having an extra 64MB of L3 cache, resulting in 96MB on one CCD and 32MB on the other.

During gaming, only one CCD with 8 cores is utilized, while the other CCD remains idle unless specifically requested by the program. This behavior is similar to the desktop 7950X3D and 7900X3D variants.

The 7945HX3D boasts a maximum boost clock of 5.4GHz and can be overclocked manually or automatically with AMD Precision Boost Overdrive. The default TDP stands at 55W and can be adjusted between 55W and 75W by the notebook manufacturer.

Due to the additional memory layer affecting heat dissipation, the maximum operating temperature has been lowered to 89°C, aligning with other 3D V-Cache models and necessitating efficient cooling for the chip.

The initial release of the 7945HX3D will be on the ASUS ROG Scar 17, commencing from August 22, and later it will become available on other models worldwide.

Source : gsmarena.com